Sr. Equipment Engineer

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. What we are doing is extremely hard, the classic moon shot. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about!

As an industry leader in photonic quantum computing, Xanadu takes hardware very seriously! In this role, you will work within the Fabrication Process Engineering team to deliver Xanadu’s photonic quantum computing hardware. With your deep technical expertise and strong experience in semiconductor or photonics equipment engineering, you will be responsible for the installation, maintenance, troubleshooting, and optimization of critical manufacturing and research equipment spanning CMP, wafer bonding, metrology, dicing, grinding, lithography, and deposition systems. Responsibilities include:

• Support the installation, maintenance, troubleshooting, and optimization of advanced semiconductor fabrication equipment in a cleanroom environment.
• Develop procedures to improve tool uptime, reduce defectivity, and execute new tool qualifications across the cleanroom.
• Prepare project plans, coordinate deliverables, and resolve complex mechanical, electrical, and control problems.
• Act as the primary equipment owner, managing critical spare parts, preventative maintenance schedules, and cleanroom gas and chemical inventories.
• Serve as a module liaison with facilities and manufacturing personnel, driving downtime recovery and corrective actions.
• Establish and maintain efficient cleanroom practices, ensuring equipment modifications and workflows meet strict environmental, quality, and safety requirements.
• Stay abreast of new developments in the field of equipment engineering and rapidly implement new learnings and equipment capabilities.

• BS or MS in Mechanical Engineering, Electrical Engineering, Materials Science, or a related technical field.
• ≥ 3 years of hands-on experience in the maintenance, repair, and troubleshooting of semiconductor manufacturing equipment.
• Specific expertise handling tools within at least two of the following categories: CMP, wafer bonding, dicing, grinding, metrology, lithography, or deposition systems.
• Demonstrated experience establishing maintenance protocols and improving tool uptime in a controlled cleanroom environment.
• Strong mechanical and electrical troubleshooting skills, including the ability to read and utilize schematics and control diagrams.
• Strong critical thinking skills and the ability to tackle challenging problems and develop innovative solutions.
• Excellent communication skills and a strong sense of teamwork.
• Experience planning and executing factory and site acceptance tests.
• Ability to travel internationally for tool training and factory acceptance tests.
• Ability to work in an ISO4 cleanroom environment, including full personal protective equipment for extended periods.

• ≥ 5 years of experience serving as an equipment engineer or equipment owner in a semiconductor fab, medical device manufacturing, or high-traffic university nanofabrication facility.
• Deep knowledge of cleanroom environmental controls, safety protocols for hazardous gases and chemicals, and compliance standards.
• Track record of successfully scaling up new hardware configurations from high-mix/low-volume R&D to high-volume production.
• Proven experience establishing maintenance protocols and documenting standard operating procedures within a rigorous ISO 9001 certified environment.
• Experience integrating automation equipment or utilizing 3D printing/rapid prototyping for custom tooling.
• Experience working collaboratively with process engineers to resolve complex defectivity issues and optimize process-equipment interactions.