Teams at Cadence Design Systems

Lead the development of advanced packaging and 3DIC analysis flows. Requires extensive experience in signal integrity and power integrity related to IC and PCB design, as well as customer interaction. Must have strong knowledge of Cadence tools and advanced packaging concepts.

The role involves leading physical design, methodology development, implementation, and verification in advanced technology nodes, ensuring successful tapeouts.

Lead technical architect providing cross-project technical leadership and strategic direction. Make long-term architectural decisions, resolve complex design issues, drive processes and projects, mentor engineers, and partner with sales, accounts and executives to influence product strategy and customer outcomes.