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Micron Technology

Snr Engineer - Package Silicon Integration

Posted 5 Days Ago
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Penang, Daerah Timor Laut, Penang
Mid level
Penang, Daerah Timor Laut, Penang
Mid level
The role involves integrating silicon technology with package technologies, developing plans, defining test vehicles, and collaborating with teams to enhance yield and quality in memory applications.
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Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR71520 Snr Engineer - Package Silicon Integration (Evergreen)

We are seeking an integration engineer in Micron's Package Development Engineering (PDE) Group to drive groundbreaking Technode development. You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA. You will drive the technology development through multiple phases of maturity.

Key Responsibilities

  • Understand the roadmap for silicon and package technology across different market segments and identify solutions to meet ambitious business needs.

  • Develop and implement plans to integrate new silicon technology with new package technologies for various memory applications, addressing Chip Package Interaction (CPI) issues.

  • Define test vehicles, plan DOEs, characterize enabling technologies, document best-known processes, and hand-off to manufacturing.

  • Worked with silicon, package, and saw street designers to find solutions and implement relevant design rules.

  • Collaborate with worldwide R&D/manufacturing wafer fabs and packaging teams to solve relevant issues and improve yield, quality, and manufacturability.
     

Job Requirements

  • 3 to 8 years of experience in assembly / front end (wafer integration, package integration) / simulation or package construction 

  • Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Physics, or Material Science Engineering preferred.

  • Proven experience in IC Package development with exposure to front-end fab processes.

  • Experience in fab metallization or BEOL integration and cross-functional project management is highly preferred.

  • Strong interpersonal, oral, and written English communication skills.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.


To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Top Skills

Electrical Engineering
Material Science Engineering
Microelectronics
Physics

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