Principal / Sr. Principal Program Manager (Semiconductor)

Key Responsibilities:

• Program Leadership: Manage and oversee all phases of ASIC and platform development, including architecture, design, verification, validation, bring-up, and production readiness.
• Cross-Functional Coordination: Work closely with internal teams, including digital design, design verification, DFT, physical design, analog design, packaging and substrate design, PCB and platform design, silicon bring-up, firmware, and software teams.
• Vendor and Customer Management: Collaborate with external vendors for IP sourcing, ensuring compliance with project timelines and requirements. Interface with customers to define deliverables and ensure seamless integration of IP and silicon solutions.
• Schedule and Risk Management: Define program timelines, set milestones, and proactively identify and mitigate risks to ensure timely project delivery.
• Budget and Resource Allocation: Manage program budgets, allocate resources efficiently, and track expenses to optimize development efforts.
• Technical Reviews and Decision-Making: Conduct regular program reviews, assess technical challenges, and drive strategic decisions to optimize performance, cost, and schedule.
• Process Improvement: Define and enhance program management best practices, improving execution efficiency across teams and projects.
• Documentation and Reporting: Maintain clear and detailed documentation, provide regular program updates, and report progress to key stakeholders.

Qualifications:

• Bachelor’s or Master’s degree in Electrical or Computer Engineering, or a related field.
• 15+ years of experience in semiconductor program management, with a strong background in ASIC development.
• Proven ability to lead and drive large-scale, complex semiconductor projects across multiple disciplines.
• Experience in working with external IP vendors and customers on deliverables and integration requirements.
• Strong understanding of the entire silicon development lifecycle, including front-end and back-end design, packaging, PCB design, and bring-up.
• Excellent problem-solving, leadership, and decision-making skills.
• Strong verbal and written communication skills, with the ability to interface with both technical and non-technical stakeholders.
• Experience with project management tools (e.g., Jira, MS Project, Confluence) and methodologies (Agile, Waterfall).
• Experience with networking ASICs, mixed-signal PHY SOCs, high-performance computing, AI/ML accelerators preferred
• Knowledge of firmware and software development in relation to silicon bring-up.
• PMP or similar program management certification is a plus.