Location: Ottawa On, Burlington On
Job Summary:
Semtech’s Signal Integrity Products (SIP) group designs and manufactures high performance mixed-signal integrated circuits for the world’s leading data and video communication companies to enable their next-generation products. We are looking for someone eager of working at the cutting edge of hardware technology, specifically in the field of high speed 3D modeling to enable product evaluation and testing. If you are someone who loves technical challenges, who is detail-oriented, and enjoys being part of a high-performing team, we want to talk to you.
Primary responsibilities:
Lead high-speed modeling and optimization of validation and test hardware (PCB, cabling, fixtures, interfaces) for semiconductor products across wafer, chip, and package formats
Collaborate in product design meetings to ensure optimal validation and test hardware performance
Evaluate and deploy emerging hardware materials and component technologies to meet increasing data rate demands
Conduct post mortem analysis and performance assessments to drive continuous hardware improvements
The right candidate will be able to:
Develop and maintain strong collaborative relationships across all functions within a project team (design, product, test, characterization, validation, applications)
Be an active member of the Signal Integrity modeling team, promoting cross-learning with peers
Develop or implement scalable methodologies in response to aggressive project timelines
Manage multiple projects and tasks
Identify and drive innovations through data-driven analysis and performance insights
Minimum Qualifications:
Bachelor’s degree in electrical engineering or related discipline with 7+ years of experience
Experience in validation and/or test hardware development and bring-up
Track record collaborating with PCB design and manufacturing services
Advanced knowledge of high speed communication protocol such as NRZ, PAM4 and PCIe.
Proficiency with EDA design software: Keysight Advanced Design System, Ansys Signal and Power Integrity (HFSS, SiWave, Q3D), Cadence Allegro X 25.1
Desired Qualifications
Master’s degree in electrical engineering or related discipline with 10+ years of experience
Hands-on PCB layout experience
Familiar with Laser drivers and Trans-Impedance Amplifiers used for opto-telecommunications
The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
A reasonable estimate of the pay range for this position is $116,000 - $155,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.
