General Description:
We are looking for an intern who can contribute technical expertise and work with a team of scientists and engineers that designs, fabricates, integrates, and tests state of the art packages
Essential Duties:
Support and assist a diverse team of scientists and engineers in the development of novel 2.5D and 3D package devices. The role includes support in the development of novel 2.5D and 3D semiconductor integration processes for dense high speed mixed signal electronics applications.
Perform theory-driven analyses of candidate approaches.
Assist with research and development projects.
Present results in written reports and oral presentations.
Assist in physical and electrical package evaluation
Assist in the development and microfabrication of passive devices.
Required Skills:
Ability to perform and organize data analysis
Understanding of basic package device assembly processes and techniques.
Background in semiconductor processing techniques (lithography, dry etch, vacuum deposition, etc.) and how they relate to device design and layout.
Required Education:
Student currently pursuing a degree in Materials Science, Physics, Chemistry, Engineering, or a related field.
Physical Requirements:
Proficiency in use of computers, engineering workstations, verbal and written communication, interaction with customers/colleagues, and a deadline-driven/fast-paced environment
Special Requirements:
U.S. Person Status is required.
Compensation:
The pay range for this position is $30 - $35 per hour.
Our pay ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hires for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific range during the hiring process.
